Chapter 1. Overview Of Mixed-Signal Testing
- 1.1 Mixed-Signal Circuits
- 1.2 Why Test Mixed-Signal Devices?
- 1.3 Post-Silicon Production Flow
- 1.4 Test And Diagnostic Equipment
- 1.5 New Product Development
- 1.6 Mixed-Signal Testing Challenges
Chapter 2. Tester Hardware
- 2.1 Mixed-Signal Tester Overview
- 2.2 DC Resources
- 2.3 Digital Subsystem
- 2.4 Ac Source And Measurement
- 2.5 Time Measurement System
- 2.6 RF-Subsystem
- 2.7 Computing Hardware
- 2.8 Summary
Chapter 3. DC And Parametric Measurements
- 3.1 Continuity
- 3.2 Leakage Currents
- 3.3 Power Supply Currents
- 3.4 DC References And Regulators
- 3.5 Impedance Measurements
- 3.6 DC Offset Measurements
- 3.7 DC Gain Measurements
- 3.8 DC Power Supply Rejection Ratio
- 3.9 DC Common-Mode Rejection Ratio
- 3.10 Comparator DC Tests
- 3.11 Voltage Search Techniques
- 3.12 DC Tests For Digital Circuits
- 3.13 Summary
Chapter 4. Data Analysis And Probability Theory
- 4.1 Data Visualization Tools
- 4.2 Statistical Analysis
- 4.3 Non-Gaussian Distributions Found In Mixed-Signal Test
- 4.4 Modeling The Structure Of Randomness
- 4.5 Sums And Differences Of Random Variables
- 4.6 Summary
Chapter 5 Yield, Measurement Accuracy And Test Time
- 5.1 Yield
- 5.2 Measurement Terminology
- 5.3 A Mathematical Look At Repeatability, Bias And Accuracy
- 5.4 Calibrations And Checkers
- 5.5 Tester Specifications
- 5.6 Reducing Measurement Error With Greater Measurement Time
- 5.8 Effects Of Measurement Variability On Test Yield
- 5.9 Effects Of Reproducibilty And Process Variation On Yield
- 5.10 Statistical Process Control
- 5.11 Summary
Chapter 6 DAC Testing
- 6.1 Basics Of Data Converters
- 6.2 Basic DC Tests
- 6.3 Transfer Curve Tests
- 6.4 Dynamic DAC Tests
- 6.5 Tests For Common DAC Applications
- 6.6 Summary
Chapter 7 ADC Testing
- 7.1 ADC Testing Versus DAC Testing
- 7.2 ADC Code Edge Measurements
- 7.3 DC Tests And Transfer Curve Tests
- 7.4 Dynamic ADC Tests
- 7.5 Tests For Common ADC Applications
- 7.6 Summary
Chapter 8 Sampling Theory
- 8.1 Analog Measurements Using DSP
- 8.2 Sampling And Reconstruction
- 8.3 Repetitive Sample Sets
- 8.4 Synchronization Of Sampling Systems
- 8.5 Summary
Chapter 9 DSP-Based Testing
- 9.1 Advantages Of DSP -Based Testing
- 9.2 Digital Signal Processing
- 9.3 Discrete-Time Transforms
- 9.4 The Inverse FFT
- 9.5 Summary
Chapter 10 Analog Channel Testing
- 10.1 Overview
- 10.2 Gain And Level Tests
- 10.3 Phase Tests
- 10.4 Distortion Tests
- 10.5 Signal Rejection Tests
- 10.6 Noise Tests
- 10.7 Summary
Chapter 11 Sampled Channel Testing
- 11.1 Overview
- 11.2 Sampling Considerations
- 11.3 Undersampling And Aliasing
- 11.4 Encoding And Decoding
- 11.5 Sampled Channel Tests
- 11.6 Summary
Chapter 12 Fundamentals Of Rf Testing
- 12.1 Introduction To Rf Testing
- 12.2 Scalar Versus Vector Measures
- 12.3 Noise
- 12.4 S-Parameters
- 12.5 Modulation
- 12.6 Summary
Chapter 13 Rf Test Methods
- 13.1 Scalar Measurement Methods
- 13.2 S-Parameter Measurements
- 13.3 Noise Figure And Noise Factor
- 13.4 Phase Noise
- 13.5 Vector Signal Analysis
- 13.6 Summary
Chapter 14 Clock And Serial Data Communications Channel Measurements
- 14.1 Synchronous And Asynchronous Communications
- 14.2 Time-Domain Attributes Of A Clock Signal
- 14.3 Frequency-Domain Attributes Of A Clock Signal
- 14.4 Communicating Serially Over A Channel
- 14.5 Bit Error Rate Measurement
- 14.6 Methods To Speed Up Ber Tests In Production
- 14.7 Deterministic Jitter Decomposition
- 14.8 Jitter Transmission Tests
- 14.9 Summary
Chapter 15 Tester Interfacing - Dib Design
- 15.1 Dib Basics
- 15.2 Printed Circuit Boards
- 15.3 Dib Traces, Shields, And Guards
- 15.4 Transmission Lines
- 15.5 Impedance Matching Techniques For Rf Dib
- 15.6 Grounding And Power Distribution
- 15.7 Dib Components
- 15.8 Common Dib Circuits
- 15.9 Common Dib Mistakes
- 15.10 Summary
Chapter 16 Design-For-Test (Dft)
- 16.1 Overview
- 16.2 Advantages Of Dft
- 16.3 Digital Scan
- 16.4 Digital Bist
- 16.5 Digital Dft For Mixed-Signal Circuits
- 16.6 Mixed-Signal Boundary Scan And Bist
- 16.7 Ad Hoc Mixed-Signal Dft
- 16.8 Rf Dft
- 16.8.1 Rf Loop-Back Test
- 16.8.2 Rf Bit And Bist
- 16.8.3 Correlation-Based Test
- 16.9 Summary
Appendix
Problem Answers
Index
Problem Answers
Index
With the proliferation of complex semiconductor devices containing digital, analog, mixed-signal, and radio-frequency circuits, today's engineer must be fluent in all four circuit types. Written for advanced undergraduate and graduate-level students, as well as engineering professionals, An Introduction to Mixed-Signal IC Test and Measurement, Second Edition, encompasses analog, mixed-signal and radio-frequency circuits tests, with many relevant industrial examples. The text assumes a solid background in analog and digital circuits and a working knowledge of computers and computer programming.
An Introduction to Mixed-Signal IC Test and Measurement, Second Edition, includes examples and illustrations--featuring state-of-the-art industrial technology--to enrich and enliven the text. The book also introduces large-scale mixed-signal circuit and individual circuit tests, discusses the value-added benefits of mixed-signal IC testing to a manufacturer's product, and clearly defines the role of the test engineer.
New to This Edition
- A new chapter on RF Test Methods and Fundamentals of RF Testing.
- A new chapter on Clock and Serial Data Communications Channel Measurements.
- Coverage of RF load board design.
- New coverage of probabilistic reasoning for mixed-signal testing.
About the Authors
- Gordon Roberts is James McGill Professor in the Department of Electrical and Computer Engineering at McGill University. He has conducted extensive research on analog integrated circuit design and mixed-signal test issues. Dr. Roberts has published numerous papers at IEEE conferences, coauthored several textbooks related to mixed-signal test and analog integrated circuit design (including SPICE, Second Edition, with Adel Sedra, OUP, 1996), and contributed various specialized volumes to other books.
- Friedrich Taenzler is an RF-Engineering Manager at Texas Instruments and a major contributor in the field of RF testing and design.
- Mark Burns is a former TI fellow at Texas Instruments and an accomplished expert in mixed-signal IC test and measurement area.
Book Details
- Hardcover: 864 pages
- Publisher: Oxford University Press, USA; 2 edition (2012)
- Language: English
- ISBN-10: 0199796211
- ISBN-13: 978-0199796212
- Product Dimensions: 9.4 x 7.7 x 1.5 inches
List Price: $149.00